Reconfigurable antenna systems with ground tuning pads

ABSTRACT

Reconfigurable antenna systems with ground tuning pads are provided herein. In certain configurations, an antenna system includes an antenna element, a first tuning conductor spaced apart from the antenna element on a first side of the antenna element, a second tuning conductor spaced apart from the antenna element on a second side of the antenna element, a first ground tuning pad configured to receive a ground voltage, and a first switch electrically connected between the first tuning conductor and the first ground tuning pad. The first switch is operable to selectively connect the first tuning conductor to the first ground tuning pad to thereby tune the antenna element.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/982,155, filed May 17, 2018 and titled “RECONFIGURABLE ANTENNA SYSTEMWITH GROUND TUNING PADS,” which claims the benefit of priority under 35U.S.C. § 119 of U.S. Provisional Patent Application No. 62/507,938,filed May 18, 2017 and titled “RECONFIGURABLE ANTENNA SYSTEM WITH GROUNDTUNING PADS,” which is herein incorporated by reference in its entirety.

BACKGROUND Field

Embodiments of the invention relate to electronic systems, and inparticular, to radio frequency (RF) electronics.

Description of Related Technology

A radio frequency (RF) communication system can include a transceiver, afront end, and one or more antennas for wirelessly transmitting andreceiving signals. The front end can include low noise amplifier(s) foramplifying signals received via the antenna(s), and power amplifier(s)for boosting signals for transmission via the antenna(s).

Examples of RF communication systems include, but are not limited to,mobile phones, tablets, base stations (including macro cell basestations and small cell base stations), network access points,customer-premises equipment (CPE), laptops, and wearable electronics.

SUMMARY

In certain embodiments, the present disclosure relates to an antennasystem. The antenna system includes a first antenna element, a firsttuning conductor spaced apart from the first antenna element andoperable to load the first antenna element, a first ground tuning padconfigured to receive a ground voltage, and a first switch electricallyconnected between the first tuning conductor and the first ground tuningpad. The first switch is operable to selectively connect the firsttuning conductor to the ground voltage by way of the first ground tuningpad to thereby tune the first antenna element.

In some embodiments, a state of the first switch is operable to tune abandwidth of the first antenna element.

In various embodiments, the first ground tuning pad includes a pluralityof metal regions of different widths, and the plurality of metal regionshaving an impedance that modifies a resonant frequency of the firstantenna element when the first switch is closed.

In a number of embodiments, the antenna system further includes a secondground tuning pad configured to receive the ground voltage, a secondtuning conductor adjacent to and spaced apart from the first antennaelement and operable to load the first antenna element, and a secondswitch electrically connected between the second tuning conductor andthe second ground tuning pad. According to several embodiments, thefirst tuning conductor and the second tuning conductor are positionedalong different sides of the first antenna element.

In some embodiments, the antenna system further includes a secondantenna element, and the first tuning conductor is spaced apart from thesecond antenna element and operable to load the second antenna element.

In several embodiments, the antenna system further includes a secondantenna element, a second ground tuning pad configured to receive theground voltage, and a second switch electrically connected between thesecond tuning conductor and the second ground tuning pad. In accordancewith a number of embodiments, the second tuning conductor spaced apartfrom the second antenna element and operable to load the second antennaelement.

In various embodiments, the first switch is operable to ground the firsttuning conductor in a first state and to electrically float the firsttuning conductor in a second state.

In a number of embodiments, the first antenna element is a patchantenna, a dipolar antenna, a ceramic resonator, a stamped metalantenna, or a laser direct structuring antenna.

In several embodiments, the first ground tuning pad and the first switchare integrated on a module substrate. According to various embodiments,the module substrate includes at least one conductive layer including aground plane, and the first ground tuning pad is configured to receivethe ground voltage from the ground plane. In accordance with a number ofembodiments, the first antenna element and the first tuning conductorare integrated on the module substrate. According to some embodiments,the first antenna element and the first tuning conductor are integratedon a glass substrate that is coupled to the module substrate.

In certain embodiments, the present disclosure relates to a radiofrequency module. The radio frequency module includes a module substrateincluding a ground plane, a ground tuning pad configured to receive aground voltage from the ground plane, a via in the module substrate, anda switch electrically connected between the via and the ground tuningpad The via is configured to couple to a tuning conductor that loads anantenna element, and the switch is operable to selectively connect thevia to the ground plane by way of the ground tuning pad to thereby tunethe antenna element.

In a number of embodiments, the ground tuning pad and the ground planeare formed on a common conductive layer of the module substrate.

In various embodiments, the ground tuning pad includes a plurality ofmetal regions of different widths, and the plurality of metal regionshaving an impedance that modifies a resonant frequency of the antennaelement when the switch is closed.

In several embodiments, the antenna element and the tuning conductor areimplemented on a common conductive layer of the module substrate.

In some embodiments, a state of the switch is operable to tune abandwidth of the antenna element.

In certain embodiments, the present disclosure relates to a mobiledevice. The mobile device includes a power amplifier configured togenerate a radio frequency transmit signal, an antenna element includinga signal feed configured to receive the radio frequency transmit signal,a tuning conductor spaced apart from the antenna element and operable toload the antenna element, a ground tuning pad configured to receive aground voltage, and a switch electrically connected between the tuningconductor and the ground tuning pad. The switch is operable toselectively connect the tuning conductor to the ground voltage by way ofthe ground tuning pad to thereby tune the antenna element.

In a number of embodiments, a state of the switch is operable to tune abandwidth of the antenna element.

In certain embodiments, the present disclosure relates to a radiofrequency module. The radio frequency module includes a module substrateincluding a ground plane, a first ground tuning pad configured toreceive a ground voltage from the ground plane, a first antenna elementon a first side of the module substrate, a first tuning conductoradjacent to and spaced apart from the first antenna element on the firstside of the module substrate, and a first switch electrically connectedbetween the first tuning conductor and the first ground tuning pad. Thefirst tuning conductor is operable to load the first antenna element,and the first switch is operable to selectively connect the first tuningconductor to the ground plane by way of the first ground tuning pad soas to tune the first antenna element.

In a number of embodiments, the first ground tuning pad and the groundplane are formed on a common conductive layer of the module substrate.

In some embodiments, the first ground tuning pad includes a plurality ofconductive regions of different widths. According to severalembodiments, the plurality of regions of different widths includes atleast one narrow region operable to serve as a tuning inductor and atleast one wide region operable to serve as a tuning capacitor. Inaccordance with various embodiments, the plurality of regions ofdifferent widths includes a wide region and a plurality of narrowregions connected between the wide region and the ground plane.

In several embodiments, a state of the first switch is operable to tunea bandwidth of the first antenna element.

In a number of embodiments, a state of the first switch is operable tosteer a direction of polarization of the first antenna element.

In various embodiments, the radio frequency module further includes asemiconductor die including the first switch. In accordance with someembodiments, the semiconductor die is embedded in an internal layer ofthe module substrate. According to several embodiments, thesemiconductor die is on a second side of the module substrate oppositethe first side.

In some embodiments, the radio frequency module further includes asecond ground tuning pad electrically connected to the ground plane, asecond tuning conductor adjacent to and spaced apart from the firstantenna element and operable to load the first antenna element, and asecond switch electrically connected between the second tuning conductorand the second ground tuning pad.

In various embodiments, the first tuning conductor and the second tuningconductor are positioned along different sides of the first antennaelement.

In a number of embodiments, the module substrate is a laminate.

In several embodiments, the first antenna element is configured toreceive radio waves.

In a number of embodiments, the first antenna element is configured totransmit radio waves.

In various embodiments, the first antenna element is configured to bothtransmit and receive radio waves.

In some embodiments, the radio frequency module further includes asecond antenna element on the first side of the module substrateadjacent to the first antenna element. According to a number ofembodiments, the first tuning conductor is adjacent to and spaced apartfrom the second antenna element and is operable to load the secondantenna element. In accordance with several embodiments, the radiofrequency module further includes a second ground tuning padelectrically connected to the ground plane, a second tuning conductoradjacent to and spaced apart from the second antenna element andoperable to load the second antenna element, and a second switchelectrically connected between the second tuning conductor and thesecond ground tuning pad.

In a number of embodiments, the first switch is operable to ground thefirst tuning conductor in a first state and to electrically float thefirst tuning conductor in a second state.

In several embodiments, the first switch is a field-effect transistorswitch.

In some embodiments, the first antenna element is a patch antenna, adipolar antenna, a ceramic resonator, a stamped metal antenna, or alaser direct structuring antenna.

In a number of embodiments, the radio frequency module further includesan antenna array on the first side of the module substrate and includinga plurality of antenna elements including the first antenna element.According to several embodiments, the antenna array is operable toprovide beamforming. In accordance with various embodiments, the antennaarray is operable to provide multi-input and multiple outputcommunications.

In certain embodiments, the present disclosure relates to a mobilecommunication device for operating in a wireless network. The mobilecommunication device includes a first antenna element, a first tuningconductor adjacent to and spaced apart from the first antenna element, afirst ground tuning pad configured to receive a ground voltage, and afirst switch electrically connected between the first tuning conductorand the first ground tuning pad. The first tuning conductor is operableto load the first antenna element, and the first switch is operable toselectively connect the first tuning conductor to the ground voltage byway of the first ground tuning pad so as to tune the first antennaelement.

In a number of embodiments, the first ground tuning pad includes aplurality of conductive regions of different widths. According toseveral embodiments, the plurality of regions of different widthsincludes at least one narrow region operable to serve as a tuninginductor and at least one wide region operable to serve as a tuningcapacitor. In accordance with various embodiments, the plurality ofregions of different widths includes a wide region and a plurality ofnarrow regions configured to provide the ground voltage to the wideregion.

In some embodiments, a state of the first switch is operable to tune abandwidth of the first antenna element.

In various embodiments, a state of the first switch is operable to steera direction of polarization of the first antenna element.

In a number of embodiments, the mobile communication device furtherincludes a semiconductor die including the first switch.

In several embodiments, the mobile communication device further includesa second ground tuning pad configured to receive the ground voltage, asecond tuning conductor adjacent to and spaced apart from the firstantenna element and operable to load the first antenna element, and asecond switch electrically connected between the second tuning conductorand the second ground tuning pad. In according with various embodiments,the first tuning conductor and the second tuning conductor arepositioned along different sides of the first antenna element.

In a number of embodiments, the mobile communication device furtherincludes a front end system and a transceiver electrically coupled tothe first antenna element via the front end system. In accordance withsome embodiments, the front end system includes a power amplifierconfigured to provide a transmit radio frequency signal to the firstantenna element. According to several embodiments, the front end systemincludes a low noise amplifier configured to amplify a radio frequencysignal received from the first antenna element.

In various embodiments, the mobile communication device further includesa second antenna element adjacent to the first antenna element.According to a number of embodiments, the first tuning conductor isadjacent to and spaced apart from the second antenna element and isoperable to load the second antenna element. In accordance with severalembodiments, the mobile communication device further includes a secondground tuning pad configured to receive the ground voltage, a secondtuning conductor adjacent to and spaced apart from the second antennaelement and operable to load the second antenna element, and a secondswitch electrically connected between the second tuning conductor andthe second ground tuning pad.

In a number of embodiments, the first switch is operable to ground thefirst tuning conductor in a first state and to electrically float thefirst tuning conductor in a second state.

In various embodiments, the first switch is a field-effect transistorswitch.

In several embodiments, the first antenna element is a patch antenna, adipolar antenna, a ceramic resonator, a stamped metal antenna, or alaser direct structuring antenna.

In some embodiments, the mobile communication device further includes anantenna array including a plurality of antenna elements including thefirst antenna element. In accordance with a number of embodiments, theantenna array is operable to provide beamforming. According to variousembodiments, the antenna array is operable to provide multi-input andmultiple output communications.

In certain embodiments, the present disclosure relates to a base stationfor a wireless network. The base station includes a first antennaelement, a first tuning conductor adjacent to and spaced apart from thefirst antenna element, a first ground tuning pad configured to receive aground voltage, and a first switch electrically connected between thefirst tuning conductor and the first ground tuning pad. The first tuningconductor is operable to load the first antenna element, and the firstswitch is operable to selectively connect the first tuning conductor tothe ground voltage by way of the first ground tuning pad so as to tunethe first antenna element.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of this disclosure will now be described, by way ofnon-limiting example, with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of one example of a communication network.

FIG. 2A is a schematic diagram of one example of a downlink channelusing multi-input and multi-output (MIMO) communications.

FIG. 2B is schematic diagram of one example of an uplink channel usingMIMO communications.

FIG. 3 is a schematic diagram of one example of a communication systemthat operates with beamforming.

FIG. 4A is a schematic diagram of one example of beamforming to providea transmit beam.

FIG. 4B is a schematic diagram of one example of beamforming to providea receive beam.

FIG. 5A is a schematic diagram of one embodiment of an antenna systemwith tuning.

FIG. 5B is a schematic diagram of another embodiment of an antennasystem with tuning.

FIG. 5C illustrates two schematic depictions of a ground tuning pad.

FIG. 6A is a plan view of another embodiment of an antenna system withtuning.

FIG. 6B is a perspective view of one embodiment of an RF module.

FIG. 7A is schematic diagram of one embodiment of a ground tuning pad.

FIG. 7B is schematic diagram of another embodiment of a ground tuningpad.

FIG. 7C is schematic diagram of another embodiment of a ground tuningpad.

FIG. 8A is a cross-section of another embodiment of an RF module.

FIG. 8B is a cross-section of another embodiment of an RF module.

FIG. 8C is a cross-section of the RF module of FIG. 8A attached to aprinted circuit board according to one embodiment.

FIG. 8D is a cross-section of the RF module of FIG. 8B attached to aprinted circuit board according to one embodiment.

FIG. 8E is a cross-section of the RF module of FIG. 8A attached to aprinted circuit board according to another embodiment.

FIG. 8F is a cross-section of an RF module and a glass substrateaccording to one embodiment.

FIG. 8G is a cross-section of an RF module and a glass substrateaccording to another embodiment.

FIG. 8H is a cross-section of an RF module and a glass substrateaccording to another embodiment.

FIG. 8I is a cross-section of an RF module and stacked glass substratesaccording to one embodiment.

FIG. 8J is a cross-section of an RF module and an IPD die according toone embodiment.

FIG. 8K is a cross-section of an RF module and a glass panel accordingto one embodiment.

FIG. 9 is a schematic diagram of one embodiment of a mobile device.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

The following detailed description of certain embodiments presentsvarious descriptions of specific embodiments. However, the innovationsdescribed herein can be embodied in a multitude of different ways, forexample, as defined and covered by the claims. In this description,reference is made to the drawings where like reference numerals canindicate identical or functionally similar elements. It will beunderstood that elements illustrated in the figures are not necessarilydrawn to scale. Moreover, it will be understood that certain embodimentscan include more elements than illustrated in a drawing and/or a subsetof the elements illustrated in a drawing. Further, some embodiments canincorporate any suitable combination of features from two or moredrawings.

The International Telecommunication Union (ITU) is a specialized agencyof the United Nations (UN) responsible for global issues concerninginformation and communication technologies, including the shared globaluse of radio spectrum.

The 3rd Generation Partnership Project (3GPP) is a collaboration betweengroups of telecommunications standard bodies across the world, such asthe Association of Radio Industries and Businesses (ARIB), theTelecommunications Technology Committee (TTC), the China CommunicationsStandards Association (CCSA), the Alliance for TelecommunicationsIndustry Solutions (ATIS), the Telecommunications Technology Association(TTA), the European Telecommunications Standards Institute (ETSI), andthe Telecommunications Standards Development Society, India (TSDSI).

Working within the scope of the ITU, 3GPP develops and maintainstechnical specifications for a variety of mobile communicationtechnologies, including, for example, second generation (2G) technology(for instance, Global System for Mobile Communications (GSM) andEnhanced Data Rates for GSM Evolution (EDGE)), third generation (3G)technology (for instance, Universal Mobile Telecommunications System(UMTS) and High Speed Packet Access (HSPA)), and fourth generation (4G)technology (for instance, Long Term Evolution (LTE) and LTE-Advanced).

The technical specifications controlled by 3GPP can be expanded andrevised by specification releases, which can span multiple years andspecify a breadth of new features and evolutions.

In one example, 3GPP introduced carrier aggregation (CA) for LTE inRelease 10. Although initially introduced with two downlink carriers,3GPP expanded carrier aggregation in Release 14 to include up to fivedownlink carriers and up to three uplink carriers. Other examples of newfeatures and evolutions provided by 3GPP releases include, but are notlimited to, License Assisted Access (LAA), enhanced LAA (eLAA),Narrowband Internet-of-Things (NB-IOT), Vehicle-to-Everything (V2X), andHigh Power User Equipment (HPUE).

3GPP plans to introduce Phase 1 of fifth generation (5G) technology inRelease 15 (targeted for 2018) and Phase 2 of 5G technology in Release16 (targeted for 2019). Release 15 is anticipated to address 5Gcommunications at less than 6 GHz, while Release 16 is anticipated toaddress communications at 6 GHz and higher. Subsequent 3GPP releaseswill further evolve and expand 5G technology. 5G technology is alsoreferred to herein as 5G New Radio (NR).

Preliminary specifications for 5G NR support a variety of features, suchas communications over millimeter wave spectrum, beam formingcapability, high spectral efficiency waveforms, low latencycommunications, multiple radio numerology, and/or non-orthogonalmultiple access (NOMA). Although such RF functionalities offerflexibility to networks and enhance user data rates, supporting suchfeatures can pose a number of technical challenges.

The teachings herein are applicable to a wide variety of communicationsystems, including, but not limited to, communication systems usingadvanced cellular technologies, such as LTE-Advanced, LTE-Advanced Pro,and/or 5G NR.

FIG. 1 is a schematic diagram of one example of a communication network10. The communication network 10 includes a macro cell base station 1, asmall cell base station 3, and various examples of user equipment (UE),including a first mobile device 2 a, a wireless-connected car 2 b, alaptop 2 c, a stationary wireless device 2 d, a wireless-connected train2 e, and a second mobile device 2 f.

Although specific examples of base stations and user equipment areillustrated in FIG. 1, a communication network can include base stationsand user equipment of a wide variety of types and/or numbers.

For instance, in the example shown, the communication network 10includes the macro cell base station 1 and the small cell base station3. The small cell base station 3 can operate with relatively lowerpower, shorter range, and/or with fewer concurrent users relative to themacro cell base station 1. The small cell base station 3 can also bereferred to as a femtocell, a picocell, or a microcell. Although thecommunication network 10 is illustrated as including two base stations,the communication network 10 can be implemented to include more or fewerbase stations and/or base stations of other types.

Although various examples of user equipment are shown, the teachingsherein are applicable to a wide variety of user equipment, including,but not limited to, mobile phones, tablets, laptops, IoT devices,wearable electronics, customer premises equipment (CPE),wireless-connected vehicles, wireless relays, and/or a wide variety ofother communication devices.

The illustrated communication network 10 of FIG. 1 supportscommunications using a variety of technologies, including, for example,4G LTE, 5G NR, and wireless local area network (WLAN), such as Wi-Fi.Although various examples of communication technologies have beenprovided, the communication network 10 can be adapted to support a widevariety of communication technologies.

Various communication links of the communication network 10 have beendepicted in FIG. 1. The communication links can be duplexed in a widevariety of ways, including, for example, using frequency-divisionduplexing (FDD) and/or time-division duplexing (TDD). FDD is a type ofradio frequency communications that uses different frequencies fortransmitting and receiving signals. FDD can provide a number ofadvantages, such as high data rates and low latency. In contrast, TDD isa type of radio frequency communications that uses about the samefrequency for transmitting and receiving signals, and in which transmitand receive communications are switched in time. TDD can provide anumber of advantages, such as efficient use of spectrum and variableallocation of throughput between transmit and receive directions.

In certain implementations, user equipment can communication with a basestation using one or more of 4G LTE, 5G NR, and Wi-Fi technologies. Incertain implementations, enhanced license assisted access (eLAA) is usedto aggregate one or more licensed frequency carriers (for instance,licensed 4G LTE and/or 5G NR frequencies), with one or more unlicensedcarriers (for instance, unlicensed Wi-Fi frequencies).

The communication links can operate over a wide variety of frequencies.In certain implementations, communications are supported using 5G NRtechnology over one or more frequency bands that are less than 6Gigahertz (GHz) and/or over one or more frequency bands that are greaterthan 6 GHz. In one embodiment, one or more of the mobile devices supporta HPUE power class specification.

In certain implementations, a base station and/or user equipmentcommunicates using beamforming. For example, beamforming can be used tofocus signal strength to overcome path losses, such as high lossassociated with communicating over high signal frequencies. In certainembodiments, user equipment, such as one or more mobile phones,communicate using beamforming on millimeter wave frequency bands in therange of 30 GHz to 300 GHz and/or upper centimeter wave frequencies inthe range of 6 GHz to 30 GHz, or more particularly, 24 GHz to 30 GHz.

Different users of the communication network 10 can share availablenetwork resources, such as available frequency spectrum, in a widevariety of ways.

In one example, frequency division multiple access (FDMA) is used todivide a frequency band into multiple frequency carriers. Additionally,one or more carriers are allocated to a particular user. Examples ofFDMA include, but are not limited to, single carrier FDMA (SC-FDMA) andorthogonal FDMA (OFDMA). OFDMA is a multicarrier technology thatsubdivides the available bandwidth into multiple mutually orthogonalnarrowband subcarriers, which can be separately assigned to differentusers.

Other examples of shared access include, but are not limited to, timedivision multiple access (TDMA) in which a user is allocated particulartime slots for using a frequency resource, code division multiple access(CDMA) in which a frequency resource is shared amongst different usersby assigning each user a unique code, space-divisional multiple access(SDMA) in which beamforming is used to provide shared access by spatialdivision, and non-orthogonal multiple access (NOMA) in which the powerdomain is used for multiple access. For example, NOMA can be used toserve multiple users at the same frequency, time, and/or code, but withdifferent power levels.

Enhanced mobile broadband (eMBB) refers to technology for growing systemcapacity of LTE networks. For example, eMBB can refer to communicationswith a peak data rate of at least 10 Gbps and a minimum of 100 Mbps foreach user. Ultra-reliable low latency communications (uRLLC) refers totechnology for communication with very low latency, for instance, lessthan 2 milliseconds. uRLLC can be used for mission-criticalcommunications such as for autonomous driving and/or remote surgeryapplications. Massive machine-type communications (mMTC) refers to lowcost and low data rate communications associated with wirelessconnections to everyday objects, such as those associated with Internetof Things (IoT) applications.

The communication network 10 of FIG. 1 can be used to support a widevariety of advanced communication features, including, but not limitedto, eMBB, uRLLC, and/or mMTC.

FIG. 2A is a schematic diagram of one example of a downlink channelusing multi-input and multi-output (MIMO) communications. FIG. 2B isschematic diagram of one example of an uplink channel using MIMOcommunications.

MIMO communications use multiple antennas for simultaneouslycommunicating multiple data streams over common frequency spectrum. Incertain implementations, the data streams operate with differentreference signals to enhance data reception at the receiver. MIMOcommunications benefit from higher SNR, improved coding, and/or reducedsignal interference due to spatial multiplexing differences of the radioenvironment.

MIMO order refers to a number of separate data streams sent or received.For instance, MIMO order for downlink communications can be described bya number of transmit antennas of a base station and a number of receiveantennas for UE, such as a mobile device. For example, two-by-two (2×2)DL MIMO refers to MIMO downlink communications using two base stationantennas and two UE antennas. Additionally, four-by-four (4×4) DL MIMOrefers to MIMO downlink communications using four base station antennasand four UE antennas.

In the example shown in FIG. 2A, downlink MIMO communications areprovided by transmitting using M antennas 43 a, 43 b, 43 c, . . . 43 mof the base station 41 and receiving using N antennas 44 a, 44 b, 44 c,. . . 44 n of the mobile device 42. Accordingly, FIG. 2A illustrates anexample of M×N DL MIMO.

Likewise, MIMO order for uplink communications can be described by anumber of transmit antennas of UE, such as a mobile device, and a numberof receive antennas of a base station. For example, 2×2 UL MIMO refersto MIMO uplink communications using two UE antennas and two base stationantennas. Additionally, 4×4 UL MIMO refers to MIMO uplink communicationsusing four UE antennas and four base station antennas.

In the example shown in FIG. 2B, uplink MIMO communications are providedby transmitting using N antennas 44 a, 44 b, 44 c, . . . 44 n of themobile device 42 and receiving using M antennas 43 a, 43 b, 43 c, . . .43 m of the base station 41. Accordingly, FIG. 2B illustrates an exampleof N×M UL MIMO.

By increasing the level or order of MIMO, bandwidth of an uplink channeland/or a downlink channel can be increased.

MIMO communications are applicable to communication links of a varietyof types, such as FDD communication links and TDD communication links.

FIG. 3 is a schematic diagram of one example of a communication system110 that operates with beamforming. The communication system 110includes a transceiver 105, signal conditioning circuits 104 a 1, 104 a2 . . . 104 an, 104 b 1, 104 b 2 . . . 104 bn, 104 m 1, 104 m 2 . . .104 mn, and an antenna array 102 that includes antenna elements 103 a 1,103 a 2 . . . 103 an, 103 b 1, 103 b 2 . . . 103 bn, 103 m 1, 103 m 2 .. . 103 mn. In one embodiment at least a portion of the antenna elements103 a 1, 103 a 2 . . . 103 an, 103 b 1, 103 b 2 . . . 103 bn, 103 m 1,103 m 2 . . . 103 mn are loaded by one or more tuning conductors toprovide antenna configurability in accordance with the teachings herein.

Communications systems that communicate using millimeter wave carriers(for instance, 30 GHz to 300 GHz), centimeter wave carriers (forinstance, 3 GHz to 30 GHz), and/or other frequency carriers can employan antenna array to provide beam formation and directivity fortransmission and/or reception of signals.

For example, in the illustrated embodiment, the communication system 110includes an array 102 of m×n antenna elements, which are each controlledby a separate signal conditioning circuit, in this embodiment. Asindicated by the ellipses, the communication system 110 can beimplemented with any suitable number of antenna elements and signalconditioning circuits.

With respect to signal transmission, the signal conditioning circuitscan provide transmit signals to the antenna array 102 such that signalsradiated from the antenna elements combine using constructive anddestructive interference to generate an aggregate transmit signalexhibiting beam-like qualities with more signal strength propagating ina given direction away from the antenna array 102.

In the context of signal reception, the signal conditioning circuitsprocess the received signals (for instance, by separately controllingreceived signal phases) such that more signal energy is received whenthe signal is arriving at the antenna array 102 from a particulardirection. Accordingly, the communication system 110 also providesdirectivity for reception of signals.

The relative concentration of signal energy into a transmit beam or areceive beam can be enhanced by increasing the size of the array. Forexample, with more signal energy focused into a transmit beam, thesignal is able to propagate for a longer range while providingsufficient signal level for RF communications. For instance, a signalwith a large proportion of signal energy focused into the transmit beamcan exhibit high effective isotropic radiated power (EIRP).

In the illustrated embodiment, the transceiver 105 provides transmitsignals to the signal conditioning circuits and processes signalsreceived from the signal conditioning circuits. As shown in FIG. 3, thetransceiver 105 generates control signals for the signal conditioningcircuits. The control signals can be used for a variety of functions,such as controlling the phase of transmitted or received signals tocontrol beam forming.

FIG. 4A is a schematic diagram of one example of beamforming to providea transmit beam. FIG. 4A illustrates a portion of a communication systemincluding a first signal conditioning circuit 114 a, a second signalconditioning circuit 114 b, a first antenna element 113 a, and a secondantenna element 113 b.

Although illustrated as included two antenna elements and two signalconditioning circuits, a communication system can include additionalantenna elements and/or signal conditioning circuits. For example, FIG.4A illustrates one embodiment of a portion of the communication system110 of FIG. 3.

The first signal conditioning circuit 114 a includes a first phaseshifter 130 a, a first power amplifier 131 a, a first low noiseamplifier (LNA) 132 a, and switches for controlling selection of thepower amplifier 131 a or LNA 132 a. Additionally, the second signalconditioning circuit 114 b includes a second phase shifter 130 b, asecond power amplifier 131 b, a second LNA 132 b, and switches forcontrolling selection of the power amplifier 131 b or LNA 132 b.

Although one embodiment of signal conditioning circuits is shown, otherimplementations of signal conditioning circuits are possible. Forinstance, in one example, a signal conditioning circuit includes one ormore band filters, duplexers, and/or other components.

In the illustrated embodiment, the first antenna element 113 a and thesecond antenna element 113 b are separated by a distance d.Additionally, FIG. 4A has been annotated with an angle θ, which in thisexample has a value of about 90° when the transmit beam direction issubstantially perpendicular to a plane of the antenna array and a valueof about 0° when the transmit beam direction is substantially parallelto the plane of the antenna array.

By controlling the relative phase of the transmit signals provided tothe antenna elements 113 a, 113 b, a desired transmit beam angle θ canbe achieved. For example, when the first phase shifter 130 a has areference value of 0°, the second phase shifter 130 b can be controlledto provide a phase shift of about −2πf(d/v)cosθ radians, where f is thefundamental frequency of the transmit signal, d is the distance betweenthe antenna elements, v is the velocity of the radiated wave, and π isthe mathematic constant pi.

In certain implementations, the distance d is implemented to be about½λ, where λ is the wavelength of the fundamental component of thetransmit signal. In such implementations, the second phase shifter 130 bcan be controlled to provide a phase shift of about −π cos θ radians toachieve a transmit beam angle θ.

Accordingly, the relative phase of the phase shifters 130 a, 130 b canbe controlled to provide transmit beamforming. In certainimplementations, a transceiver (for example, the transceiver 105 of FIG.3) controls phase values of one or more phase shifters to controlbeamforming.

FIG. 4B is a schematic diagram of one example of beamforming to providea receive beam. FIG. 4B is similar to FIG. 4A, except that FIG. 4Billustrates beamforming in the context of a receive beam rather than atransmit beam.

As shown in FIG. 4B, a relative phase difference between the first phaseshifter 130 a and the second phase shifter 130 b can be selected toabout equal to −2πf(d/v)cos θ radians to achieve a desired receive beamangle θ. In implementations in which the distance d corresponds to about½λ, the phase difference can be selected to about equal to −π cos θradians to achieve a receive beam angle θ.

Although various equations for phase values to provide beamforming havebeen provided, other phase selection values are possible, such as phasevalues selected based on implementation of an antenna array,implementation of signal conditioning circuits, and/or a radioenvironment.

Moreover, in certain applications, it is desirable for an antenna systemto have a tunable bandwidth, thereby providing control over transmitand/or receive frequencies.

The communication networks and systems of FIGS. 1-4B illustrate exampleradio frequency electronics that can include a reconfigurable antennasystem with ground tuning pads. However, the teachings herein areapplicable to other implementations of radio frequency electronics.

Examples of Reconfigurable Antenna Systems with Ground Tuning Pads

Reconfigurable antenna systems with ground tuning pads are providedherein. In certain configurations, an antenna system includes a modulesubstrate including a ground plane and a ground tuning pad configured toreceive a ground voltage from the ground plane. The antenna systemfurther includes an antenna element and a tuning conductor that isspaced apart from the antenna element and operable to load the antennaelement. Furthermore, a switch is electrically connected between thetuning conductor and the ground tuning pad, and operates to selectivelyconnect the tuning conductor to the ground plane by way of the groundtuning pad to provide tuning to the antenna element.

By implementing the antenna system in this manner, antennacharacteristics of the antenna element can be controlled. For example,when the switch connects the tuning conductor to the ground plane, thetuning conductor provides a secondary resonance that modifies theoperation of the antenna element relative to when the tuning conductoris disconnected from the ground plane (for instance, electricallyfloating).

The secondary resonance is controlled by characteristics of the groundtuning pad, such as shape and/or size. For instance, the ground tuningpad can include regions of different widths to provide inductance and/orcapacitance to achieve desired tuning characteristics. In one example,the ground tuning pad includes at least one narrow region operable toserve as a tuning inductor and at least one wide region operable toserve as a tuning capacitor. In another example, the ground tuning padincludes a wide region and multiple narrow regions that connect the wideregion to the ground plane.

In certain implementations, multiple switch-controlled tuning conductorsare provided for tuning one or more antenna elements. In one example, anantenna element is tuned by two or more tuning conductors. In a secondexample, separate tuning conductors are provided for two or more antennaelements. In a third example, a shared tuning conductor is used to tunetwo or more antenna elements.

Accordingly, selection of the state of switches can control a bandwidthand/or a direction of polarization of the antenna element, therebyproviding frequency and/or polarization configurability.

In certain implementations, the antenna element includes a signal feedfor receiving an RF signal and a ground feed that is selectivelyconnected to the ground plane via a ground feed switch. Including theground feed switch provides a further mechanism or knob to tune antennacharacteristics. For example, the ground feed switch can be used tomodify the antenna element's operational characteristics by eitherconnecting the ground feed to the ground plane or disconnecting theground feed from the ground plane (for instance, electrically floatingthe ground feed). In certain configurations, the ground feed switch isconnected to the ground plane by way of a ground tuning pad, therebyproviding further enhanced flexibility in achieving a desired tuningcharacteristic.

The switch state of the antenna system can be changed over time, therebyreconfiguring the antenna system to provide desired performancecharacteristics at a given moment. For example, the state of theswitches can be controlled to provide an optimal or near-optimalradiation pattern at a given time for a particular operatingenvironment. Thus, seamless connectivity between a communication deviceand a base station can be provided as the communication device movesrelative to the base station and/or as a signaling environment changes.In one example, the state of the switches is controlled to maintaincircular polarization of a communication device on the move.

In certain implementations, the state of the switches is controlledbased on feedback parameters of a communication link between UE and abase station. Thus, the switch state can be set using a control loop,via a closed or semi-closed system, to achieve appropriate antennacharacteristics.

In one example, the antenna system can be included a communicationdevice that is communicating with a base station. Additionally, areceive strength signal indicator (RSSI), an error rate indicator,and/or other signal from the base station can be used to controlselection of the switch state of the communication device. In anotherexample, the antenna system is included in a base station thatwirelessly communicates with a communication device. Additionally, anRSSI, an error rate indicator, and/or other signal from thecommunication device can be used to control selection of the switchstate of the base station.

In certain implementations, the antenna element and the tuning conductorare integrated on a module substrate along with the ground plane, theground tuning pad, and the switch. However, other configurations arepossible, such as implementations in which the antenna element and thetuning conductor are implemented on a glass substrate that is connectedto a module substrate in which the ground plane, the ground tuning pad,and the switch are integrated. For instance, in a first example, theglass substrate corresponds to a glass panel with an antenna element anda tuning conductor integrated therein. In a second example, the glasssubstrate is part of an integrated passive devices (IPD) die on whichthe antenna element and the tuning conductor are fabricated.

FIG. 5A is a schematic diagram of one embodiment of an antenna system160 with tuning. The antenna system 160 includes an antenna element 151,a tuning conductor 156, a switch 157, and a ground tuning pad 158.

The tuning conductor 156 is adjacent to and spaced apart from theantenna element 151. Although not electrically connected by metal, thetuning conductor 156 is electromagnetically coupled (for example,capacitively coupled) to the antenna element 151 and operates to loadthe antenna element 151, thereby impacting one or more characteristicsof the antenna element 151. Although the tuning conductor 156 isillustrated as a rectangular strip of metal, the tuning conductor 156can be shaped in other ways.

The ground tuning pad 158 receives a ground voltage, for instance, froma ground plane.

As shown in FIG. 5A, the switch 157 is electrically connected betweenthe tuning conductor 156 and the ground tuning pad 158. Additionally,the switch 157 serves to selectively connect the tuning conductor 156 tothe ground voltage by way of the ground tuning pad 158. Thus, in a firststate the switch 157 is closed to connect the tuning conductor 156 tothe ground tuning pad 158, and in a second state the switch 157 isopened to disconnect the tuning conductor 156 from the ground tuning pad158. Opening or closing the switch 157 provides a mechanism to tune anantenna characteristic of the antenna element 151, such as a bandwidthand/or direction of polarization.

By implementing the antenna system 160 in this manner, antennacharacteristics of the antenna element 151 can be controlled. Forexample, when the tuning conductor 156 is connected to ground, thetuning conductor 156 provides a secondary resonance that modifies theoperation of the antenna element 151 relative to when the tuningconductor 156 is disconnected from ground (for instance, electricallyfloating).

The secondary resonance is controlled by characteristics of the groundtuning pad 158, such as the shape and/or size of the conductor servingas the ground tuning pad 158. For instance, the ground tuning pad 158can include regions of different widths to provide inductance and/orcapacitance to thereby achieve desired tuning. In one example, theground tuning pad 158 includes at least one narrow region operable toserve as a tuning inductor and at least one wide region operable toserve as a tuning capacitor. In another example, the ground tuning pad158 includes a wide region and multiple narrow regions that connect thewide region to the ground plane.

Various example implementations of the ground tuning pad 158 will bediscussed below with reference to FIGS. 6B-7C.

FIG. 5B is a schematic diagram of another embodiment of an antennasystem 170 with tuning. The antenna system 170 of FIG. 5B is similar tothe antenna system 160 of FIG. 5A, except that the antenna system 170includes multiple antenna elements 151-154.

Although an example with four antenna elements are shown, the teachingsherein are applicable to a wide variety of antenna systems, includingconfigurations using more or fewer antenna elements.

The antenna elements 151-154 can correspond to antenna elementsimplemented in a wide variety of ways. For instance, examples of antennaelements include, but are not limited to, patch antennas, dipoleantennas, ceramic resonators, stamped metal antennas, and/or laserdirect structuring antennas.

The tuning capacitor 156 serves to load the antenna elements 151-154.Thus, the state of the switch 157 can be controlled to tune thebandwidth of the antenna elements 151-154.

Although FIG. 5B illustrates an example in which a shared tuningconductor is used to tune two or more antenna elements, the teachingsherein are also applicable to implementations in which multipleswitch-controlled tuning conductors are provided for tuning one or moreantenna elements. In one example, an antenna element is tuned by two ormore tuning conductors. In a second example, separate tuning conductorsare provided for two or more antenna elements.

FIG. 5C illustrates two schematic depictions of a ground tuning pad 158.The schematic depictions correspond to any embodiment of a ground tuningpad implemented in accordance with the teachings herein. Examples ofsuch ground tuning pads include, but are not limited to, the groundtuning pads of FIGS. 7A-7C.

FIG. 6A is a plan view of another embodiment of an antenna system 240with tuning.

The antenna system 240 includes a patch antenna element 201, a firsttuning conductor 211, a second tuning conductor 212, a third tuningconductor 213, a fourth tuning conductor 214, a first transistor switch221, a second transistor switch 222, a third transistor switch 223, afourth transistor switch 224, a ground feed switch 225, a first groundtuning pad 231, a second ground tuning pad 232, a third ground tuningpad 233, a fourth ground tuning pad 234, and a fifth ground tuning pad235.

Although FIG. 6A illustrates an implementation of an antenna system withone patch antenna element, four tuning conductors, five switches, andfive ground tuning pads, other configurations are possible. For example,an antenna system can include other numbers and/or types of tuningconductors, switches, and/or ground tuning pads. Moreover, the teachingsherein are applicable to antenna systems including additional patchantennas, such as an array of patch antennas, as well as to antennasystems using other types of antenna elements. Accordingly, otherimplementations are possible.

The patch antenna element 201 includes a signal feed 202 for receiving asignal and a ground feed 203 for receiving ground. In the illustratedembodiment, the antenna system 240 further includes a ground feed switch225 for selectively connecting the ground feed 203 to ground, therebyproviding an additional knob for controlling the antenna characteristicsof the antenna system 240. The ground feed switch 203 can be connectedto ground via a ground tuning pad 235, thereby providing further controlover antenna tuning. In another embodiment, the ground feed switch 225and/or the ground tuning pad 235 are omitted.

The patch antenna element 201 can be used for transmitting and/orreceiving signals, depending on implementation. Accordingly, the patchantenna element 201 can serve as a transmit antenna, a receive antenna,or a transmit/receive antenna. In one example, the signal feed 202receives a transmit signal, such as a power amplifier output signal. Inanother example, the signal feed 202 is used to provide a receive signalto a low noise amplifier (LNA) or other receiver circuitry.

Although the illustrated patch antenna element 201 is substantiallyoctagonal in shape, a patch antenna element can be shaped in a widevariety of ways. Furthermore, although the illustrated tuning conductors211-214 are substantially rectangular in shape, tuning conductors can beshaped in a wide variety of ways.

The patch antenna element 201 and the tuning conductors 211-214 can beimplemented in a planar configuration. For example, the antenna system240 can be implemented on a surface of a substrate, such as a laminate.Thus, the patch antenna element 201 and the tuning conductors 211-214can be implemented on a patterned conductive layer of a substrate.

In the illustrated embodiment, the tuning conductors 211-214 are spacedapart from the patch antenna element 201, and surround a boundary orperimeter of the patch antenna element 201, but are spaced aparttherefrom. For example, the first tuning conductor 211 is positionedadjacent a top side of the patch antenna element 201, the second tuningconductor 212 is positioned adjacent a right side of the patch antennaelement 201, the third tuning conductor 213 is positioned adjacent abottom side of the patch antenna element 201, and the fourth tuningconductor 214 is positioned adjacent a left side of the patch antennaelement 201.

Although an example including four rectangular tuning conductors isillustrated, the teachings herein are applicable to implementationsincluding more or fewer tuning conductors and/or tuning conductors withdifferent shapes, sizes, and/or orientations. Accordingly, otherimplementations are possible.

As shown in FIG. 6A, the transistor switches 221-224 individuallycontrol connection of the tuning conductors 211-214 to ground via theground tuning pads 231-234, respectively. Although an example with aone-to-one correspondence between switches and tuning conductors isshown, in certain implementations one switch controls two or more tuningconductors and/or one tuning conductor is controlled by two or moreswitches.

In the illustrated embodiment, the first transistor switch 221 iselectrically connected between the first tuning conductor 211 and thefirst ground tuning pad 231, and is controlled by a first control signalC1. Additionally, the second transistor switch 222 is electricallyconnected between the second tuning conductor 212 and the second groundtuning pad 232, and is controlled by a second control signal C2.Furthermore, the third transistor switch 223 is electrically connectedbetween the third tuning conductor 213 and the third ground tuning pad233, and is controlled by a third control signal C3. Additionally, thefourth transistor switch 224 is electrically connected between thefourth tuning conductor 214 and the fourth ground tuning pad 234, and iscontrolled by a fourth control signal C4.

Although an implementation using transistor switches is shown, otherimplementations of switches are possible, such as implementations usingpin diode switches and/or microelectromechanical switches.

The control signals C1-C4 can be generated in a wide variety of ways. Inone example, a transceiver of a communications device generates thecontrol signals C1-C4 to thereby control the state of the transistorswitches 221-224. In certain implementations, data stored in aprogrammable memory, such as a non-volatile memory, is used to controlthe switch state.

The control signals C1-C4 are used to selectively connect the transistorswitches 221-224, respectively, to ground, thereby changing the antennacharacteristics of the antenna system 240.

Accordingly, the antenna system 240 is reconfigurable by controlling thestate of the transistor switches 221-224. Thus, antenna characteristicssuch as bandwidth and/or polarization can be controlled. For example,implementing the antenna system 240 in this manner can aid in tuningfrequency bandwidth and/or steering polarization in a particulardirection.

FIG. 6B is a perspective view of one embodiment of an RF module 340 withground tuning. The RF module 340 includes a module substrate 300including an internal ground plane. The RF module 340 further includes apatch antenna element 301, a first tuning conductor 311, a second tuningconductor 312, a third tuning conductor 313, a fourth tuning conductor314, a first ground tuning pad 331, a second ground tuning pad 332, athird ground tuning pad 333, and a fourth ground tuning pad 334. Withrespect to FIG. 6B, certain layers have been depicted transparently sothat certain components, such as vias, are visible.

Although not illustrated in FIG. 6B, the RF module 340 further includesa switch connected between each of the tuning conductors 311-314 and theground tuning pads 331-334, respectively. The switches have been omittedfrom FIG. 6B for clarity of the figures. However, the switches can beincluded in a wide variety of locations, for instance, by inserting aswitch in series with each of the vias 335 used for connecting to thetuning conductors 311-314. The switches can be implemented in a widevariety of ways, including, for example, using surface mount switchesand/or switches fabricated on a semiconductor die or chip.

The patch antenna element 301 includes a signal feed 302 and a groundfeed (not illustrated in FIG. 6B). In the illustrated embodiment, thesignal feed 302 is implemented as a center conductor that iscapacitively coupled to the patch antenna element 301 to thereby feedthe patch antenna element 301. Additionally, a slot 339 has beenincluded in the patch antenna element 301 adjacent to the signal feed302. Including the slot aids in controlling the input impedance into thepatch antenna element 301 from the signal feed 302.

Although FIG. 6B illustrates one implementation of an RF module withtuning, the teachings herein are applicable to RF modules implemented ina wide variety of ways. Accordingly, other implementations are possible.

FIG. 7A is schematic diagram of one embodiment of a ground tuning pad350. The ground tuning pad 350 is formed on a conductive layer of modulesubstrate that also includes a ground plane 348.

The ground tuning pad 350 includes a switch interface region 341 that iselectrically connected to a switch, which in turn is connected to atuning conductor. In certain implementations, the switch interfaceregion 341 is connected by via to a switch on another layer of themodule substrate.

As shown in FIG. 7A, the ground tuning pad 350 further includes a wideor center region 342, which is connected to the switch interface region341 by a first thin region 343. In this embodiment, the wide region 342is connected to the ground plane 348 using multiple thin regions,including a second thin region 344 and a third thin region 345.

By implementing the antenna system in this manner, antennacharacteristics of the antenna element can be controlled. For example,when the tuning conductor is connected to ground, the tuning conductorprovides a secondary resonance that modifies the operation of theantenna element relative to when the tuning conductor is disconnectedfrom ground (for instance, electrically floating).

When a tuning conductor is connected to the ground plane 348 by way ofthe ground tuning pad 350, a secondary resonance is provided to anantenna element. The secondary resonance is controlled bycharacteristics of the ground tuning pad 350, such as the shape and/orsize of the conductive regions. For instance, the various regions of theground tuning pad provide inductance and/or capacitance to achieveddesired tuning characteristics. For example, narrow regions serve toprovide tuning inductance while wide regions serve to provide tuningcapacitance.

FIG. 7B is schematic diagram of another embodiment of a ground tuningpad 360. The ground tuning pad 360 illustrates another example of aground tuning pad for a reconfigurable antenna system. However, theteachings herein are applicable to ground tuning pads implemented in awide variety of ways.

In the illustrated embodiment, the ground tuning pad 360 includes aswitch interface region 351, a wide region 352, a first thin region 353,and a second thin region 354. In this example, the first thin region 353serves to connect the switch interface region 351 to the wide region352, and the second thin region 354 serves to connect the wide region352 to the ground plane 348.

FIG. 7C is schematic diagram of another embodiment of a ground tuningpad 370. The ground tuning pad 370 illustrates another example of aground tuning pad for a reconfigurable antenna system. However, theteachings herein are applicable to ground tuning pads implemented in awide variety of ways.

In the illustrated embodiment, the ground tuning pad 370 includes aswitch interface region 361, a wide region 362, a first thin region 363,a second thin region 364, a third thin region 365, a fourth thin region366, and a fifth thin region 367. In this example, the first thin region363 serves to connect the switch interface region 351 to the wide region362. Additionally, the wide region 362 is connected to the ground plane348 using multiple thin regions, including the second thin region 364,the third thin region 365, the fourth thin region 366, and the fifththin region 367.

FIG. 8A is a cross-section of another embodiment of an RF module 460.The RF module 460 includes a laminated substrate or laminate 401including a first conductive layer 421, a second conductive layer 422, athird conductive layer 423, a fourth conductive layer 424, a solder mask431, a first dielectric layer 441, a second dielectric layer 442, athird dielectric layer 443, and vias 450. The RF module 460 furtherincludes an IC 410 integrated in the laminate 401.

The first conductive layer 421 includes one or more antenna elements,such as an antenna element 401. In certain implementations, the antennaelement 401 is a patch antenna element. The first conductive layer 421further includes one or more tuning conductors, such as the tuningconductor 411. The IC 410 includes one or more switches 451.Additionally, vias 450 have been used to connect the one or more tuningconductors to corresponding switches 451 fabricated on the IC 410.

For clarity of the figures, patterning of the second conductive layer422, the third conductive layer 433, and the third conductive layer 434is not illustrated. However, conductive layers can be patterned in awide variety of ways. Furthermore, although one example of vias 450 isdepicted, the vias 450 can be placed in a wide variety of ways.

The RF module 460 further includes a ground plane formed on one or moreconductive layers. In certain implementations, the ground plane 460 isformed on the second conductive layer 422, the third conductive layer423, and/or the fourth conductive layer 424.

One or more ground tuning pads can be formed adjacent to the groundplane. For example, in certain implementations, a ground tuning pad isformed by patterning a conductive layer, such as the second conductivelayer 422, the third conductive layer 423, and/or the fourth conductivelayer 424. The ground tuning pad receives a ground voltage from theground plane, and connects to a corresponding switch 451 of the IC 410.

In the illustrated embodiment, the IC 410 is positioned internally tothe laminate 401. Implementing the RF module 460 in this manner reducesconductive route lengths, thereby enhancing performance and alleviatingrouting congestion. However, other implementations are possible. Forexample, in another embodiment, switches are implemented as surfacemount components and/or an IC on a surface of the laminate 401.

In certain implementations, the IC 410 further includes a front-endsystem (for instance, one or more signal conditioning circuits), atransceiver, and/or other circuitry of a communications device. Althoughan implementation with one semiconductor chip is shown, the teachingsherein are applicable to modules with additional chips or without chips.

In certain implementations, the IC 410 includes an interface, such as aMobile Industry Processor Interface (MIPI) Radio Frequency Front End(RFFE) bus, an inter-integrated circuit (I²C) bus, and/or ageneral-purpose input/output (GPIO) bus that receives data forcontrolling the switch state.

The laminate 401 can be implemented with layers of various thicknesses.In one specific example, the solder mask 431 is 20 μm thick, theconductive layers 421-424 are each 15 μm thick, the first dielectriclayer 441 is 300 μm thick, and the second and third dielectric layers442-443 are each 15 μm thick. Although one specific example of layerthicknesses has been provided, a laminate can be implemented in a widevariety of ways. For example, the number of, composition of, and/orthicknesses of laminate layers can vary widely based on implementationand/or application.

FIG. 8B is a cross-section of another embodiment of an RF module 470.The RF module 470 of FIG. 8B is similar to the RF module 460 of FIG. 8A,except that the RF module 470 of FIG. 8B illustrates a differentlocation of the IC 410. In particular, the IC 410 is attached by solderballs 461 to a side of the laminate 410 opposite the tuning conductorsand antenna elements, in this embodiment.

FIG. 8C is a cross-section of the RF module 460 of FIG. 8A attached to aprinted circuit board (PCB) 481 according to one embodiment. In theillustrated embodiment, the RF module 460 is attached by solder balls471 to the PCB 481. For example, attachment can be provided by way of aball grid array (BGA). Although one example of attaching the RF module460 to a PCB is shown, the RF module 460 can be attached to a multitudeof structures in a wide variety of ways.

FIG. 8D is a cross-section of the RF module 470 of FIG. 8B attached to aPCB 481 according to one embodiment. In the illustrated embodiment, theRF module 470 is attached by solder balls 471 to the PCB 481. Althoughone example of attaching the RF module 470 is shown, the RF module 470can be attached in other ways.

FIG. 8E is a cross-section of the RF module 460 of FIG. 8A attached to aPCB 481 according to another embodiment. In the illustrated embodiment,the RF module 460 is attached by pads 485 to the PCB 481. For example,attachment can be provided by way of a land grid array (LGA). Althoughanother example of attaching the RF module 460 to a PCB is shown, the RFmodule 460 any suitable attachment scheme can be used to connect the RFmodule 460 to a PCB or other structure.

FIG. 8F is a cross-section of an RF module 490 and a glass substrate 500according to one embodiment. The RF module 490 of FIG. 8F is similar tothe RF module 460 of FIG. 8A, except that the RF module 490 omits theantenna element 401 and tuning conductor 411. Rather, the glasssubstrate 500 includes the antenna element 401 and the tuning conductor411 thereon.

As shown in FIG. 8F, the first conductive layer 421 of the RF module 490has been patterned to include pads for connecting to the glass substrate500 via solder balls 491. For example, the pads can include a first pad492 a for connecting to a signal feed of the antenna element 401, asecond pad 492 b for connecting to a ground feed of the antenna element401, and a third pad 492 c for connecting to the tuning conductor 411.

The glass substrate 500 can include one or more metal layers includedthereon. Thus, the glass substrate 500 can include multiple layers, incertain implementations. Although illustrated as of equal width as thelaminate 401, the glass substrate 500 can have narrower width, greaterwidth, or equal width as the laminate 401. Furthermore, the glasssubstrate 500 can have any suitable thickness, including a thicknessless than the laminate 401, greater than the laminate 401, or equal tothe laminate 401.

Although not shown in FIG. 8A, the RF module 490 is also connected to aPCB in certain implementations. For instance, in one example, a PCB isincluded on a side of laminate 401 opposite the glass substrate 500, andthe RF module 490 is coupled to the PCB by way of a BGA, LGA, or othersuitable interface.

FIG. 8G is a cross-section of an RF module 490 and a glass substrate 510according to another embodiment. In the illustrated embodiment, theglass substrate 510 includes a conductive layer internal to the glasssubstrate 510 and including the antenna element 401 and the tuningconductor 411. Additionally, a via 501 is included in the glasssubstrate 510 for electrically connecting the third pad 492 c of the RFmodule 490 to the tuning conductor 411 via metallization.

As shown in FIG. 8B, corresponding vias in the glass substrate 510 areomitted for connecting the first pad 492 a and the second pad 492 b tothe antenna element 401 via metallization. Rather, electromagneticcoupling (for instance, capacitive coupling) is used to feed the antennaelement 401.

The teachings herein are applicable to antenna elements in which asignal feed and/or a ground feed is provided by an electrical connectionby way of metallization as well as to antenna elements in which a signalfeed and/or a ground feed is provided by electromagnetic coupling.

FIG. 8H is a cross-section of an RF module 490 and a glass substrate 520according to another embodiment. The glass substrate 520 of FIG. 8H issimilar to the glass substrate 510 of FIG. 8G, except that the glasssubstrate 520 of FIG. 8H includes vias 501 for connecting not only thethird pad 492 c to the tuning conductor 411, but also for connecting thefirst pad 492 a to the antenna element 401 and the second pad 492 b tothe antenna element 401.

FIG. 8I is a cross-section of an RF module 490 and stacked glasssubstrates according to one embodiment. As shown in FIG. 81, a firstglass substrate 531 is coupled to the pads 492 a-492 c of the RF module490 by way of solder balls 491, in this example. The first glasssubstrate 531 includes a first antenna element 401 a, a first tuningconductor 411 a, and vias 501.

Additionally, the second glass substrate 532 is stacked over the firstglass substrate 531, such that the first glass substrate 531 ispositioned between the RF module 490 and the second glass substrate 532.The second glass substrate 532 includes a second antenna element 401 band a second tuning conductor 411 b, which are connected by solder balls491 to the first antenna element 401 a and the first tuning conductor411 a, respectively.

In certain embodiments herein, two or more glass substrates are stacked.Furthermore, the glass substrates can include antenna elements toprovide an antenna array and/or three-dimensional antenna structures.Moreover, the glass substrates can include tuning conductors to providea tuning conductor array and/or three-dimensional tuning structures.

FIG. 8J is a cross-section of an RF module 601 and an IPD die 602according to one embodiment. The RF module 601 includes at least oneswitch 611 and at least one ground tuning pad 612 implemented inaccordance with the teachings herein. As shown in FIG. 8J, an IPD die602 is attached to the RF module 601 via balls 603 or other suitableattachment mechanism. The IPD die 602 includes at least one antennaelement 613 and at least one tuning conductor 614. In certainimplementations, the IPD die 602 includes a glass substrate on which theantenna element 613 and the tuning conductor 614 are fabricated.

FIG. 8K is a cross-section of an RF module 601 and a glass panel 622according to one embodiment. The RF module 601 includes at least oneswitch 611 and at least one ground tuning pad 612 implemented inaccordance with the teachings herein. As shown in FIG. 8K, the glasspanel 622 is attached to the RF module 601 via balls 603 or othersuitable attachment mechanism. The glass panel 622 includes at least oneantenna element 613 and at least one tuning conductor 614. In oneembodiment, the glass panel 622 corresponds to a display, for instance atouch screen display of a mobile device, tablet, or other UE.

FIG. 9 is a schematic diagram of one embodiment of a mobile device 800.The mobile device 800 includes a baseband system 801, a sub millimeterwave (mmW) transceiver 802, a sub mmW front end system 803, sub mmWantennas 804, a power management system 805, a memory 806, a userinterface 807, a mmW baseband (BB)/intermediate frequency (IF)transceiver 812, a mmW front end system 813, and mmW antennas 814.

The mobile device 800 of FIG. 9 illustrates one example of a mobiledevice that can include a reconfigurable antenna system with groundtuning pads. However, the teachings herein are applicable to otherimplementations of mobile devices.

The mobile device 800 can be used communicate using a wide variety ofcommunications technologies, including, but not limited to, 2G, 3G, 4G(including LTE, LTE-Advanced, and LTE-Advanced Pro), 5G NR, WLAN (forinstance, Wi-Fi), WPAN (for instance, Bluetooth and ZigBee), WMAN (forinstance, WiMax), and/or GPS technologies.

In the illustrated embodiment, the sub mmW transceiver 802, sub mmWfront end system 803, and sub mmW antennas 804 serve to transmit andreceive centimeter waves and other radio frequency signals belowmillimeter wave frequencies. Additionally, the mmW BB/IF transceiver812, mmW front end system 813, and mmW antennas 814 serve to transmitand receive millimeter waves. Although one specific example is shown,other implementations are possible, including, but not limited to,mobile devices operating using circuitry operating over differentfrequency ranges and wavelengths.

The sub mmW transceiver 802 generates RF signals for transmission andprocesses incoming RF signals received from the sub mmW antennas 804. Itwill be understood that various functionalities associated with thetransmission and receiving of RF signals can be achieved by one or morecomponents that are collectively represented in FIG. 9 as the sub mmWtransceiver 802. In one example, separate components (for instance,separate circuits or dies) can be provided for handling certain types ofRF signals.

The sub mmW front end system 803 aids is conditioning signalstransmitted to and/or received from the antennas 804. In the illustratedembodiment, the front end system 803 includes power amplifiers (PAs)821, low noise amplifiers (LNAs) 822, filters 823, switches 824, andduplexers 825. However, other implementations are possible.

For example, the sub mmW front end system 803 can provide a number offunctionalizes, including, but not limited to, amplifying signals fortransmission, amplifying received signals, filtering signals, switchingbetween different bands, switching between different power modes,switching between transmission and receiving modes, duplexing ofsignals, multiplexing of signals (for instance, diplexing ortriplexing), or some combination thereof.

In certain implementations, the mobile device 800 supports carrieraggregation, thereby providing flexibility to increase peak data rates.Carrier aggregation can be used for both Frequency Division Duplexing(FDD) and Time Division Duplexing (TDD), and may be used to aggregate aplurality of carriers or channels. Carrier aggregation includescontiguous aggregation, in which contiguous carriers within the sameoperating frequency band are aggregated. Carrier aggregation can also benon-contiguous, and can include carriers separated in frequency within acommon band or in different bands.

The sub mmW antennas 804 can include antennas used for a wide variety oftypes of communications. For example, the sub mmW antennas 804 caninclude antennas for transmitting and/or receiving signals associatedwith a wide variety of frequencies and communications standards.

The mmW BB/IF transceiver 812 generates millimeter wave signals fortransmission and processes incoming millimeter wave signals receivedfrom the mmW antennas 814. It will be understood that variousfunctionalities associated with the transmission and receiving of RFsignals can be achieved by one or more components that are collectivelyrepresented in FIG. 9 as the mmW transceiver 812. The mmW BB/IFtransceiver 812 can operate at baseband or intermediate frequency, basedon implementation.

The mmW front end system 813 aids is conditioning signals transmitted toand/or received from the mmW antennas 814. In the illustratedembodiment, the front end system 803 includes power amplifiers 831, lownoise amplifiers 832, switches 833, up converters 834, down converters835, and phase shifters 836. However, other implementations arepossible. In one example, the mobile device 800 operates with a BB mmWtransceiver, and up converters and downconverters are omitted from themmW front end system. In another example, the mmW front end systemfurther includes filters for filtering millimeter wave signals.

The mmW antennas 814 can include antennas used for a wide variety oftypes of communications. The mmW antennas 814 can include antennaelements implemented in a wide variety of ways, and in certainconfigurations the antenna elements are arranged to form one or moreantenna arrays. Examples of antenna elements for millimeter wave antennaarrays include, but are not limited to, patch antennas, dipole antennaelements, ceramic resonators, stamped metal antennas, and/or laserdirect structuring antennas.

In certain implementations, the mobile device 800 supports MIMOcommunications and/or switched diversity communications. For example,MIMO communications use multiple antennas for communicating multipledata streams over a single radio frequency channel. MIMO communicationsbenefit from higher signal to noise ratio, improved coding, and/orreduced signal interference due to spatial multiplexing differences ofthe radio environment. Switched diversity refers to communications inwhich a particular antenna is selected for operation at a particulartime. For example, a switch can be used to select a particular antennafrom a group of antennas based on a variety of factors, such as anobserved bit error rate and/or a signal strength indicator.

In certain implementations, the mobile device 800 operates withbeamforming. For example, the mmW front end system 803 includes phaseshifters having variable phase controlled by the transceiver 802.Additionally, the phase shifters are controlled to provide beamformation and directivity for transmission and/or reception of signalsusing the mmW antennas 814. For example, in the context of signaltransmission, the phases of the transmit signals provided to an antennaarray used for transmission are controlled such that radiated signalscombine using constructive and destructive interference to generate anaggregate transmit signal exhibiting beam-like qualities with moresignal strength propagating in a given direction. In the context ofsignal reception, the phases are controlled such that more signal energyis received when the signal is arriving to the antenna array from aparticular direction.

The baseband system 801 is coupled to the user interface 807 tofacilitate processing of various user input and output (I/O), such asvoice and data. The baseband system 801 provides the sub mmW and mmWtransceivers with digital representations of transmit signals, which areprocessed by the transceivers to generate RF signals for transmission.The baseband system 801 also processes digital representations ofreceived signals provided by the transceivers. As shown in FIG. 9, thebaseband system 801 is coupled to the memory 806 of facilitate operationof the mobile device 800.

The memory 806 can be used for a wide variety of purposes, such asstoring data and/or instructions to facilitate the operation of themobile device 800 and/or to provide storage of user information.

The power management system 805 provides a number of power managementfunctions of the mobile device 800. In certain implementations, thepower management system 805 includes a PA supply control circuit thatcontrols the supply voltages of the power amplifiers of the front endsystems. For example, the power management system 805 can be configuredto change the supply voltage(s) provided to one or more of the poweramplifiers to improve efficiency, such as power added efficiency (PAE).

In certain implementations, the power management system 805 receives abattery voltage from a battery. The battery can be any suitable batteryfor use in the mobile device 800, including, for example, a lithium-ionbattery.

CONCLUSION

Some of the embodiments described above have provided examples ofdynamic beam control in connection with wireless communication devices.However, the principles and advantages of the embodiments can be usedfor any other systems or apparatus that benefit from any of the circuitsand systems described herein.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Likewise, the word “connected”, as generally used herein, refers to twoor more elements that may be either directly connected, or connected byway of one or more intermediate elements. Additionally, the words“herein,” “above,” “below,” and words of similar import, when used inthis application, shall refer to this application as a whole and not toany particular portions of this application. Where the context permits,words in the above Detailed Description using the singular or pluralnumber may also include the plural or singular number respectively. Theword “or” in reference to a list of two or more items, that word coversall of the following interpretations of the word: any of the items inthe list, all of the items in the list, and any combination of the itemsin the list.

Moreover, conditional language used herein, such as, among others,“can,” “could,” “might,” “can,” “e.g.,” “for example,” “such as” and thelike, unless specifically stated otherwise, or otherwise understoodwithin the context as used, is generally intended to convey that certainembodiments include, while other embodiments do not include, certainfeatures, elements and/or states. Thus, such conditional language is notgenerally intended to imply that features, elements and/or states are inany way required for one or more embodiments or that one or moreembodiments necessarily include logic for deciding, with or withoutauthor input or prompting, whether these features, elements and/orstates are included or are to be performed in any particular embodiment.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. An antenna system comprising: an antenna element;a plurality of tuning conductors including a first tuning conductorspaced apart from the antenna element on a first side of the antennaelement, and a second tuning conductor spaced apart from the antennaelement on a second side of the antenna element; a first ground tuningpad configured to receive a ground voltage; and a first switchelectrically connected between the first tuning conductor and the firstground tuning pad, the first switch operable to selectively connect thefirst tuning conductor to the first ground tuning pad to thereby tunethe antenna element.
 2. The antenna system of claim 1 further comprisinga second ground tuning pad configured to receive the ground voltage, anda second switch electrically connected between the second tuningconductor and the second ground tuning pad.
 3. The antenna system ofclaim 1 wherein the first side of the antenna element is opposite thesecond side of the antenna element.
 4. The antenna system of claim 1wherein the first switch is operable to ground the first tuningconductor in a first state and to electrically float the first tuningconductor in a second state.
 5. The antenna system of claim 1 whereinthe antenna element is a patch antenna, a dipolar antenna, a ceramicresonator, a stamped metal antenna, or a laser direct structuringantenna.
 6. The antenna system of claim 1 wherein the first groundtuning pad and the first switch are integrated on a module substrate. 7.The antenna system of claim 6 wherein the module substrate includes atleast one conductive layer including a ground plane, the first groundtuning pad configured to receive the ground voltage from the groundplane.
 8. The antenna system of claim 6 wherein the antenna element andthe first tuning conductor are integrated on the module substrate. 9.The antenna system of claim 6 wherein the antenna element and the firsttuning conductor are integrated on a glass substrate that is coupled tothe module substrate.
 10. The antenna system of claim 1 wherein thefirst ground tuning pad includes a plurality of metal regions ofdifferent widths.
 11. The antenna system of claim 10 wherein theplurality of metal regions have an impedance that modifies a resonantfrequency of the antenna element when the first switch is closed.
 12. Aradio frequency module comprising: a module substrate including a firstconductive layer and a second conductive layer; an antenna elementformed in the first conductive layer; a plurality of tuning conductorsformed in the first conductive layer, the plurality of tuning conductorsincluding a first tuning conductor spaced apart from the antenna elementon a first side of the antenna element, and a second tuning conductorspaced apart from the antenna element on a second side of the antennaelement; a first ground tuning pad formed in the second conductive layerand configured to receive a ground voltage; and a first switchelectrically connected between the first tuning conductor and the firstground tuning pad, the first switch operable to selectively connect thefirst tuning conductor to the first ground tuning pad to thereby tunethe antenna element.
 13. The radio frequency module of claim 12 furthercomprising a second ground tuning pad formed in the second conductivelayer and configured to receive the ground voltage, and a second switchelectrically connected between the second tuning conductor and thesecond ground tuning pad.
 14. The radio frequency module of claim 12wherein the first side of the antenna element is opposite the secondside of the antenna element.
 15. The radio frequency module of claim 12wherein the first switch is operable to ground the first tuningconductor in a first state and to electrically float the first tuningconductor in a second state.
 16. The radio frequency module of claim 12wherein the antenna element is a patch antenna.
 17. The radio frequencymodule of claim 12 further comprising a ground plane formed in thesecond conductive layer, the first ground tuning pad configured toreceive the ground voltage from the ground plane.
 18. The radiofrequency module of claim 12 wherein the first ground tuning padincludes a plurality of metal regions of different widths.
 19. The radiofrequency module of claim 18 wherein the plurality of metal regions havean impedance that modifies a resonant frequency of the antenna elementwhen the first switch is closed.
 20. A front end system comprising: apower amplifier configured to output a radio frequency transmit signal;an antenna element configured to transmit the radio frequency transmitsignal; a plurality of tuning conductors including a first tuningconductor spaced apart from the antenna element on a first side of theantenna element, and a second tuning conductor spaced apart from theantenna element on a second side of the antenna element; a first groundtuning pad configured to receive a ground voltage; and a first switchelectrically connected between the first tuning conductor and the firstground tuning pad, the first switch operable to selectively connect thefirst tuning conductor to the first ground tuning pad to thereby tunethe antenna element.